Laser Systems
Laser Cutting, Laser Marking, Laser Engraving and Graphic Imaging
Laser cutters for schools — trade and vocational schools, high schools, colleges and universities — can help illustrate complex principles to students at all levels. A Universal laser system gives you the ability to create precise models on demand which can then be used to demonstrate concepts in physics, mathematics, engineering, design, and more.
VLS Desktop Systems
VLS2.30 DT and VLS3.60 DT
The desktop VLS2.30 DT is a compact and economical platform designed to be an entry level laser machine. The desktop VLS3.60 DT is small enough to fit on a work surface yet powerful enough to meet the requirements of on-demand production. Both are used frequently for educational purposes.
- Processing Area (WxH): 16 x 12 in (406 x 305 mm) |
24 x 18 in (610 x 457mm) - Max Laser Power: 30 watts | 60 watts
- Laser Configuration: Single
VLS/PLS Platform Systems
PLS6.150D
The PLS6.150D with SuperSpeed platform is designed and engineered for applications requiring high speed and maximum power flexibility. The PLS6.150D comes standard with SuperSpeed and Dual Laser Configuration. SuperSpeed was developed primarily for raster image applications.
- Processing Area (WxH): 32 x 18 in (813 x 457 mm)
- Max Laser Power: 150 watts
- Laser Configuration: Dual
ULTRA R Systems
ULTRA R5000
Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid technology™ enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610), with support for materials with a thickness up to 12 in (305 mm).
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
- Processing Area (WxH): 32 x 24 in (813 x 610)
- Max Laser Power: 150 watts (CO2) / 50 watts (fiber)
- Laser Configuration: two interchangeable CO2 lasers or one CO2 laser and one fiber laser
ULTRA X Systems
ULTRA X6000
The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser.
When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid technology™ enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.
- Processing Area (WxH): 36 x 24 in (914 x 610)
- Max Laser Power: 300 watts (CO2) / 50 watts (fiber)
- Laser Configuration: two interchangeable CO2 lasers and one fiber laser